Twenty years of innovations have enabled EV Group to become the leading provider of the highest quality development and production tools for aligned wafer bonding, top/bottom side photolithography, coating and wafer cleaning. For example, in 1985 the company created an industry first - a unique double-sided video alignment system that incorporated an optical backside alignment technique.

By 1990, EV Group introduced production systems for anodic and silicon direct wafer bonding. These and other developments enabled EV Group to offer the first equipment to fulfill production requirements for the microelectromechanical systems (MEMS) industry.

The technique of process separation, pioneered by EV Group has become the industry standard by providing efficient, low cost-of-ownership production systems for the MEMS market. EV Group's innovations continued with the installation of the first Silicon-On-Insulator (SOI) high-volume production bonder in 1994.

Today, EV Group's leading edge systems are at work around the world improving productivity in manufacturing companies, research and development institutes and universities. Advanced technology, precision mechanics and user friendly software, all backed by the highest quality standards, enable EV Group to continue to set performance standards for precision wafer processing.